Heat Sink Aluminum
Extrusion Profiles

Precision-engineered aluminum heat sinks for thermal management in LED lighting, power electronics, telecom equipment, industrial controls, and EV charging systems.

Precision Thermal
Management Solutions

Effective thermal management is critical to the performance, reliability, and lifespan of modern electronics. Yogi heat sink profiles are precision-engineered from high-conductivity aluminum alloys, delivering optimal heat dissipation through carefully designed fin geometries and maximized surface area.

Our in-house thermal engineering team uses advanced simulation software to model heat transfer behavior and optimize fin spacing, height, and thickness for each application — ensuring your components operate within safe temperature limits under real-world conditions.

From standard off-the-shelf profiles to fully custom geometries, we provide end-to-end solutions including extrusion, CNC machining, surface treatment, and assembly. Consult our Alloy Guide for detailed thermal conductivity data across our alloy range.

Engineered for Maximum
Thermal Performance

Every heat sink profile is optimized for thermal conductivity, airflow dynamics, and system integration requirements.

Optimized Fin Design

CFD-validated fin geometries engineered to maximize convective heat transfer while minimizing pressure drop across the heat sink.

High Surface Area

Thin, closely spaced fins deliver maximum surface area within compact envelopes, critical for space-constrained electronics applications.

Lightweight

Aluminum alloys deliver thermal performance approaching copper at one-third the weight, reducing system mass in portable and mobile applications.

CNC Machined

In-house CNC machining for mounting holes, counterbores, pockets, and thermal interface surfaces with tight flatness tolerances.

Thermal Simulation

Advanced FEA and CFD thermal modeling to predict junction temperatures and validate designs before committing to tooling.

Custom Geometries

From simple flat-back profiles to complex multi-directional fin arrays, we engineer bespoke heat sinks tailored to your thermal requirements.

Thermal & Dimensional
Specifications

Our heat sink profiles are manufactured from alloys selected for their optimal balance of thermal conductivity, extrudability, and mechanical strength. For material property comparisons, see our Alloy Guide.

Parameter Specification
Alloy Options 6063-T5, 6061-T6, 1050
Fin Height Up to 150 mm
Fin Thickness From 0.8 mm
Base Width Up to 400 mm
Thermal Conductivity Up to 220 W/mK (alloy dependent)
Surface: Anodized Black anodized, Clear anodized
Surface: Other Chromate conversion, Mill finish
Base Flatness 0.05 mm per 25 mm (CNC machined)

Thermal Management
Applications

Yogi heat sink profiles are deployed across a wide range of industries where reliable thermal management is mission-critical. Our engineering team works closely with electronics designers and system integrators to ensure optimal thermal performance within each application's unique constraints.

  • LED lighting modules and high-bay fixtures
  • Power inverters and DC-DC converters
  • Motor drives and variable frequency drives (VFDs)
  • 5G telecom base stations and RF amplifiers
  • EV charging units and onboard chargers
  • Server cooling and data center infrastructure

Each heat sink can be supplied with secondary operations including CNC machining, tapping, thermal interface material application, and fan/clip assembly. Review our Design Guidelines for thermal design best practices.

Request Thermal Analysis

Need a Thermal Management Solution?

Send us your thermal requirements and our engineering team will provide a custom heat sink recommendation within 48 hours.

Get a Free Thermal Review Compare Alloy Properties